Ol mak bilong prodak
|
PARAMETA |
Ol spesifikesen |
Yunit |
|
|
Frekwensi Renj |
fc |
100~1000MHz |
MHz |
|
Standet Frikwensi |
fc |
315,433.92,480,500,866.5 |
MHz |
|
Band Width |
2,3,5,10,20,40,o makim |
MHz |
|
|
Insertion Loss ( min) |
IL |
1.5,1.8,2.0,3.0,6.5 o makim |
dB |
|
Tempereja bilong wok |
−40~+85 |
digri |
|
|
Tempereja bilong Stoa |
−55~+125 |
digri |
|
Ol samting bilong prodak
■ Liklik sais 3.8x3.8x1.3mm
■ Welding i ken kamap wantaim otomatik mounting
■ Low-loss SAW komponent
■ Low amplitude ripple
■ Ol strongpela tok nogat long tupela aut-ben
Ol aplikesen
- SF44M6 SAW filta i stap insait long wanpela liklik 3.8×3.8mm SMD seramik seam-sil paket. Em i kamap bilong ol spes-konstrain na stebiliti-kritikal aplikesen olsem 5G bes stesin RF fran-end na ol satelit nevigesen risiva.
Ol gutpela samting bilong prodak
Liklik disain
Liklik sais bilong 3.8×3.8 mm i stret wantaim divelopmen bilong ol ilektronik divais i go long (smol na lait) na hai-density integresen. Em inap long sevim spes bilong PCB, na dispela i mekim em i gutpela tru long ol samting we i gat bikpela namba (olsem 5G bes stesin RF modul na ol liklik setelait nevigesen divais).
Gutpela pasin bilong putim antap
SMD paket i sapotim ol otomatik proses bilong putim samting, na ol i ken wokim planti wantaim ol narapela samting we ol i putim antap long graun long rot bilong ol wok olsem 'reflow soldering'.
setifiket
SF44M6 surface acoustic wave (SAW) filta em i RoHS/REACH kompliant, i no gat lid-, na i no gat halogen-.
FAQ
Q1: Wanem wok bilong seramik materiel paket i save mekim long pefomens stebiliti bilong Suzhou Hangjing's SF44M6?
A: Seramik i gat gutpela strong bilong sanap strong long bikpela hat, sanap long wetwet na sanap strong long korosen. Em inap long holim gut ol samting insait long bikpela tempereja olsem -40 digri i go inap long +85 digri, na abrusim 'frequency drift' o 'insertion loss' bilong filta bikos long bikpela senis long temperaja bilong ples, na mekim gutpela wok insait long ol kompleks envairomen olsem ol ausait beis stesin na ol indastrial ikwipmen.
Q2: Olsem wanem dispela 'packaging form' i mekim wok bilong SF44M6 i kamap gutpela moa?
A: Dielektrik konstan bilong seramik i stap gut na lus i liklik. Taim ol i bungim wantaim liklik SMD straksa, em inap long daunim hevi bilong ol parasitik paramita olsem 'lead inductance' na 'distributed capacitance' long ol 'high-frequency signals, na dispela i mekim na 'frequency selectivity' na 'signal integrity' bilong filta i stap gut long ol 'high-frequency' senario olsem 5G. Long wankain taim, bikpela 'thermal conductivity' bilong 'ceramic' i helpim long rausim hat, na i stopim wok bilong en long bagarap taim 'chip' i hat tumas.
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